Paste – Dev https://dev.additiveplus.com Thu, 24 Jul 2025 13:36:11 +0000 en-US hourly 1 https://wordpress.org/?v=6.8.5 https://dev.additiveplus.com/wp-content/uploads/cropped-AdditivePlus-Logo-Vertical-Dark-32x32.png Paste – Dev https://dev.additiveplus.com 32 32 shopengine_activated_templates a:1:{s:6:"single";a:1:{s:4:"lang";a:1:{s:2:"en";a:1:{i:7;a:3:{s:11:"template_id";i:53939;s:6:"status";b:1;s:11:"category_id";s:3:"912";}}}}} CERAMIC PASTE for Direct Ink Writing (DIW) https://dev.additiveplus.com/product/ceramic-paste-for-direct-ink-writing-diw/ Sun, 25 Aug 2024 13:42:12 +0000 https://dev.additiveplus.com/?post_type=product&p=53500 Ceramic paste ideal for robust and thermally stable components are essential.

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3D printing with ceramics is transforming various industries, capitalizing on ceramics’ renowned qualities such as exceptional heat resistance, mechanical strength, and electrical insulation. Notably, this technology is reshaping aerospace and automotive sectors by producing high-demand items like ceramic turbine blades and engine components, optimizing their performance and efficiency. These advancements in ceramic printing encompass a range of commonly procured items, including intricate ceramics and ceramic pastes. The techniques employed empower designers and engineers to enhance product performance, lower production costs, and explore innovative designs. This transformative technology is set to continue shaping industries and sparking creativity in modern ceramic-based manufacturing.

 

Ceramic Pastes Parameters:

• Aluminum Oxide (Al2O3): High thermal conductivity, electrical insulation, and resistance to wear and corrosion.

• Yttria-Stabilized Zirconia (YSZ): Excellent thermal and chemical stability, used in high-temperature applications.

• Silicon Carbide (SiC): Extremely hard and wear-resistant, with high thermal conductivity and chemical resistance.
• Zirconium Oxide (ZrO2): High fracture toughness and thermal expansion, suitable for structural applications.
• Aluminosilicate (Al2O3-SiO2): High-temperature stability and thermal shock resistance, used in refractory applications.
• Titanium Dioxide (TiO2): High refractive index and dielectric properties, commonly used in optical and electronic applications.

 

CERAMIC PASTES for Direct Ink Writing industrial applications

 

 

 

Automotive

 

• Cylinder Head Gaskets

 

Substrate Material: Alumina (aluminum oxide)
Product Name: Cotronics Resbond 940
Description: Used in high-temperature areas such as engine cylinder heads

 

 

 

 

Medical

 

• Autoclave Gaskets

 

Substrate Material: Stainless steel          Product Name: Aremco Pyro-Putty 2400
Description: Used in autoclaves for sterilizing medical instruments, requiring high temperature and pressure resistance.

 

 

 

Chemical Industry

 

• Chemical Pump Gaskets

 

Substrate Material: Graphite
Product Name: Aremco Ceramabond 503
Description: Used in chemical pumps requiring corrosion and chemical resistance.

 

 

 

Food Industry

 

• Industrial Oven Gaskets

 

Substrate Material: Clay
Product Name: Aremco Ceramabond 571

Description: Used in industrial ovens for food production, providing high temperature resistance.

 

 

 

 

Pharmaceutical Industry

 

• Chemical Reactor Gaskets

 

Substrate Material: Alumina (aluminum oxide)
Product Name: Aremco Ceramabond 569
Description: Used in chemical reactors in the pharmaceutical industry, requiring high purity and chemical resistance.

 

 

Packaging Industry

 

• Packaging Machine Gaskets

 

Substrate Material: Stainless steel
Product Name: Aremco Ceramabond 571
Description: Used in packaging machines requiring high temperature resistance.

 

 

 

Electronics

 

• High-Temperature Device Gaskets

 

Substrate Material: Alumina (aluminum oxide)
Product Name: Aremco Ceramabond 503
Description: Used in electronics operating at high temperatures, such as electronic
furnaces.

 

 

Case study. The HydroGEN project – 3D printed sealing for solid oxide electrochemical cell stacks.

 

The HydroGEN project is a modular installation of reversible Solid Oxide Cells (rSOC), intended for integration into an industrial power plant to improve its flexibility of operation and increase the use of renewable energy sources in the hydrogen power sector. It is the brainchild of our partner, the Institute of Power Engineering (IEn).

 

Constructing the stack of solid oxide

electrochemical cells

 

HydroGEN is based on reversible solid oxide electrochemical cells operating alternately according to the power-to-gas (P2G) concept – in electrolyzer (SOE – Solid Oxide Electrolyser) and fuel cell (SOFC – Solid Oxide Fuel Cell) modes. The HydroGEN-based installation was designed and delivered by IEn in form of a container system integrated with EC Elbląg power plant within the Hydrogin project (realized by CBRF Energa Grupa Orlen and IMP PAN).

 

The sealing elements of the solid oxide cell stacks, manufactured by IEn, were made using a low-cost and waste-free 3D printing method on dedicated E-NIS machines designed and manufactured by Sygnis SA.

hydrogen-project-1b-1

 

The role of seals in the stack

 

The seal used in order to separate the fuel and air zones inside the device is characterized by an ultra-low gas permeability coefficient. This requirement is met by glass-ceramic seals with strictly defined properties, optimized in the course of multivariate tests, which include: stability in oxidizing and reducing atmospheres over a wide range of partial pressures, resistance to thermal cycling over the life of the stack, compatibility of thermal expansion coefficient values with the parameters of other stack components, electrical insulation (preventing short-circuiting of cells in the stack), chemical compatibility with sealed components, as well as ease of manufacture and low cost.

hydrogen-project-2c-1

 

The seals developed at the Institute of Power Engineering are made using an innovative method of 3D printing from glass paste using the E-NIS printers developed and manufactured by Sygnis SA. This is a low-cost and waste-free technology. The spatial printing technique allows the formation of a glass paste sealing material with appropriate rheological properties directly on the flat and corrugated surfaces of SOC stack elements. It also offers the possibility to build multilayer seals, thus allowing to optimize their thickness according to the application. Direct application of the seal to SOC stack components contributes to the elimination of redundant unit operations in the preparation of glass-ceramic seals and significant time savings, allowing the process to be more efficient and maintain its high repeatability.

 

hydrogen-project-4-1

 

The spatial printing technique allows the formation of a glass paste sealing material with appropriate rheological properties directly on the flat and corrugated surfaces of SOC stack elements. It also offers the possibility to build multilayer seals, thus allowing to optimize their thickness according to the application. Direct application of the seal to SOC stack components contributes to the elimination of redundant unit operations in the preparation of glass-ceramic seals and significant time savings, allowing the process to be more efficient and maintain its high repeatability. 

 

3D printing allows for precise reproduction of the designed shape and ensures high quality and accuracy of the completed print. In addition, the use of waste-free 3D printing technology in the process of forming seals based on solid oxide electrochemical cells allows the production of seals with filler, patented by the Institute of Power Engineering. Such seals provide the required thickness and other gasket properties under equipment operating conditions, and are based on the use of, for example, waste ceramic powders from other industries as a sealing component.

 

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Silicon Nitride 3D Printing Paste https://dev.additiveplus.com/product/silicon-nitride/ Thu, 15 Apr 2021 11:15:07 +0000 https://dev.additiveplus.com/?post_type=product&p=4742 NON OXIDE CERAMICS
The Silicon Nitride is among the hardest and most resistant technical ceramics. It has also a high resistance to thermal shocks, to wear and corrosion (liquid and gas). Its application is found in the components of pumps and valves, semiconductors among others.

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Properties

  • Good resistance to thermal shocks
  • Good resistance to wear
  • Mechanical properties
  • Low wettability against molten metals
  • Good electrical insulation
  • Resistance to corrosion (liquid and gas)
  • Résistance à la corrosion (liquide et gaz)

Applications

  • Semi conductor
  • Heating tubes
  • Pump and Valves components

PHYSICAL AND MECHANICAL PROPERTIES

Densification rate>97%
Open porosity<2.5%
Density >3.13 g/cm3
4-pt bending strength881 MPa
Weibull modulus11
Theorical Young modulus290 GPa
Thermal properties from -50°C to 60 °C
Thermal conductivity at RT23.6 W/m.K
Thermal expansion coefficientat -50 °C0.67 *10^-6 K^-1
at 20 °C1.23*10^-6 K^-1
at 60°C1.52 *10^-6 K^-1

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Aluminium Nitride 3D Printing Paste https://dev.additiveplus.com/product/aluminium-nitride/ Thu, 15 Apr 2021 11:09:41 +0000 https://dev.additiveplus.com/?post_type=product&p=4738 NON OXIDE CERAMICS
The high mechanical properties of this ceramic, combined with high thermal conductivity and electrical insulation, are highly recommended in electronics industry.

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Properties

  • High thermal conductivity
  • Electrical insulation
  • Good mechanical strength

Applications

  • Electronics Industry

PHYSICAL AND MECHANICAL PROPERTIES

Densification rate 97%
Density 3.22 g/cm3
Grain sizeafter sintering < 5 µm
4-pt bendingstrength 270 MPa
TheoricalYoung modulus 368 GPa
Thermalproperties from -50°C to 60 °C
Thermalconductivity at RT 163.1 W/m.K
Thermal expansion coefficient at -50 °C 1.84 *10^-6 K^-1
at 20 °C 2.89 *10^-6 K^-1
at 60°C 3.38 *10^-6 K^-1

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Hydroxyapatite 3D Printing Paste https://dev.additiveplus.com/product/hydroxyapatite/ Thu, 15 Apr 2021 10:56:03 +0000 https://dev.additiveplus.com/?post_type=product&p=4729 OXIDE CERAMICS
Hydroxyapatite/TCP: material used in the biomedical applications for the manufacture of the osseous substitutes, chemical composition close to bone.

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Properties

  • Biocompatibility
  • Excellent bioactivity
  • Good osseointegration

Applications

  • Tibial osteotomy wedges
  • Intervertebral cages
  • Cranial implants
  • Bonne substitute
  • Spine implants
  • Orthopedic implants

PHYSICAL AND MECHANICAL PROPERTIES

Densification rate>96%
Density >1.5 g/cm3
Grain sizeafter sintering2 μm
4-pt bendingstrength107 MPa
Ca/P ratio1.65 to 1.82
Foreignphases (CaO, TCP,
alpha, TCP beta, TTCP)
 ≥5 %
Cristallinity>95%
Heavy metals<30 ppm

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Fused Silica 3D Printing Paste https://dev.additiveplus.com/product/fused-silica/ Wed, 14 Apr 2021 11:25:27 +0000 https://dev.additiveplus.com/?post_type=product&p=4670 OXIDE CERAMICS
Silice ceramics suit foundry cores and optical applications requirements.

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Properties

  • Good leachability

Applications

  • Foundry Cores

PHYSICAL AND MECHANICAL PROPERTIES

Porosity 40%
Density 1.36 g/cm3
General Properties
Cristobalite content 2%
Roughness (Ra) 1.3 μm
Dilatation max (RT -1500 °C) 0.07 %
Shrinkage before 1500 °C 4.61 %
Shrinkage at 1500 °C 0.11%

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Tricalcium Phosphate 3D Printing Paste https://dev.additiveplus.com/product/tricalcium-phosphate/ Wed, 14 Apr 2021 11:10:09 +0000 https://dev.additiveplus.com/?post_type=product&p=4662 OXIDE CERAMICS
TCP or Tricalcium Phosphate is a material often used for implants in the medical field, especially to recreate parts close to the structure of a spine.

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Properties

  • Biocompatible
  • Bioresorbable

Applications

  • Implants

PHYSICAL AND MECHANICAL PROPERTIES

Densification rate80.7 %
Density 2.47 g/cm3
Grain size after sintering 2.8 μm
General Properties
  • Presence of hydroxyapatite measured by X ray diffraction bewteen 0% and 5%.
  • No calium pyrophosphate seen by infrared analysis.
  • Ca/P ratio = 1.503

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Zirconia 8Y 3D Printing Paste https://dev.additiveplus.com/product/zirconia-8y/ Wed, 14 Apr 2021 10:54:54 +0000 https://dev.additiveplus.com/?post_type=product&p=4647 OXIDE CERAMICS
8 mol% yttria-stabilized zirconia is mainly developed for fuel cell applications.

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Properties

  • Ionic conductivity
  • Oxygen-ion conductivity
  • Heat insulating

Applications

  • Fuel Cell

PHYSICAL AND MECHANICAL PROPERTIES

Densification rate>99%
Density 5.79 g/cm3
Grain size after sintering 0.73 μm
General Properties 
linic conductivityσT=17S.cm^-1.K
(T=800°C)
σT=3S.cm^-1.K
(T=600°C)

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Cordierite 3D Printing Paste https://dev.additiveplus.com/product/cordierite/ Wed, 14 Apr 2021 10:32:31 +0000 https://dev.additiveplus.com/?post_type=product&p=4624 OXIDE CERAMICS
This low CTE and thermal conductivity ceramic is wear resistant. It suits vacuum application.

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Properties

  • Low CTE (Coefficient of Thermal Expansion)
  • Low thermal conductivity
  • Wear Resistant
  • Good for vacuum application

Applications

  • Optical parts for aerospace
  • Metrology

PHYSICAL AND MECHANICAL PROPERTIES

Densification rate>98%
Density >2.5 g/cm3
Grain sizeafter sintering 0.89 μm
4-pt bending strength150 MPa
Weibullmodulus6.5
TheoricalYoung modulus140 GPa
Thermalproperties from -50°C to 60 °C
Thermalconductivity at RT3.8 W/m.K
Thermal expansion coefficientat -50 °C-0.87 *10^-6 K^-1
 at 20 °C-0.10 *10^-6 K^-1
 at 60°C0.22 *10^-6 K^-1

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Alumina Toughened Zirconia 3D Printing Paste https://dev.additiveplus.com/product/alumina-toughened-zirconia/ Wed, 14 Apr 2021 10:09:06 +0000 https://dev.additiveplus.com/?post_type=product&p=4616 OXIDE CERAMICS
Alumina Toughened Zirconia, known for their biocompatibility and their resistance to wear and thermal shock, are recommended for biomedical and industry applications.
The ceramic ATZ combines both Alumina (20%) and Zirconia (80%) ceramics in one. The mix of these two combined offers several properties.

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Properties

  • Great Hardness and tenacity
  • Biocompatibility
  • Resistance to wear and thermal shock

Applications

  • Implants
  • Teeth
  • Wear resistant parts

PHYSICAL AND MECHANICAL PROPERTIES

Densification rate >99%
Density >5.2 g/cm3
Grain size after sintering <0.5 µm
4-pt bending strength 1094 MPa
Weibull modulus 5.8
Theorical Young modulus 220 GPa
Thermal properties from -50°C to 60 °C
Thermal conductivity at RT 5.4 W/m.K
Thermal expansion coefficientat -50 °C7.50 *10^-6 K^-1
 at 20 °C7.94*10^-6 K^-1
 at 60°C8.33 *10^-6 K^-1

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